MEMS
Nanochips core technology is array atomic probes, moved
with Micro-Electrical Mechanical System (MEMS) actuators,
combined with ultra-dense, nonvolatile, re-writable media. The process
of fabrication is entirely performed by semiconductor fabrication
tools in mass production, utilizing silicon wafer substrates. Two
wafers containing the "head stack" die on one wafer, and
the media on another wafer, are bonded together. This wafer stack
is sawed into individual die pairs to form the storage units. Each
die pair contains the read/write heads on one die and the other
the data storage media. Bit densities of 1 Terabit/in2
are typical. The storage substrate utilizes a proprietary technology,
with demonstrated rewrite cycles exceeding 1013.
Nanochip MEMS read/write array
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